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Complete Outsoursing to the Electronics Industry

Our service does not stop at PCB reverse engineering & design. We also manage PCB manufacturing & distribution via our relationships with small & large contract manufacturers in China & overseas.

 
We specialise in Single & Double Sided, Multilayer, Flexible, Flexi-Rigid & HDI requirements.
  • We only use certified producers of PCB's - Underwriters Laboratories
  • V0 rating for FR4
  • V0 rating for High Tg FR4
  • V0 rating for Flex
  • V0 rating for Flex-rigid using FR4
  • BS EN ISO 9001:2000
  • IECQ to BS 123000 (CECC) (Cert. no. 022/QCA)
Technical Capability
  • Maximum number of Layers: 36
  • Minimum Track: 75 µm; (3mil)
  • Minimum Gap: 75 µm; (3mil)
  • Smallest Mechanically Drilled Holes: 0.2mm
  • Smallest Mechanically Drilled Blind Holes: 150 µm; (6mil)
  • Smallest Laser Drilled Holes: 25 µm; (1mil)
  • Smallest Laser Drilled Blind Holes: 50 µm; (2mil)
  • Smallest Buried holes: 25µm; (1mil)
  • Aspect Ratio Max - through holes 15:1 (FHS)
  • Aspect Ratio Max - blind holes 1:1 (FHS)
  • Controlled Impedance ±5%
  • Edge Plating
  • Edge Plated Half Holes
  • Edge Plated Fingers
  • Buried Resistor +/- 15%
  • Resin Filled Vias
  • Copper Filled Blind Vias
Item Technical Parameters Specification
Min. Line Width (mil) 3 Finished product Copper thickness 0.5 OZ
Min. Space (mil) 3 Finished product Copper thickness 0.5 OZ
Min. Annular Ring Width (mil) VIAS: 3mils Component Holes : 5mils Remained ring width means the distance between the hole edge to the ring outskirt
Min. Hole Size Board Thickness < 2.0mm
0.2mm Finished product
  Board Thickness < 1.2mm
0.1mm Finished product
  Board Thickness > 2.0mm
Aspect Ratio < 10 Finished product
Max. Board Thickness Single and Double Side
8.0mm  
  Multilayer
8.0mm  
Min. Board Thickness Single and Double Side
0.2mm  
  Multilayer
4 layers: 0.4mm; 6 layers: 0.6mm; 8 layers: 1.0mm; 10 layers: 1.2mm  
Max. Board Size Single and Double Side
609 x 609mm  
  Multilayer
550 x 810mm  
Distance between Line to Board edge V-CUT: 0.4mm V-CUT: 0.33mm (Board Thickness > 1.2mm)  
Max. Layers 30 layers  
Solder Mask Window (mil)
2/4 1. Single side; 2. 2mil is allowed for mask bridge or avoiding exposed lines.
  Mask Bridge (mil)
6 Between IC pins
  Color
White, Black, Blue, Green, Yellow, Red, etc.  
Legend Min. Line Width (mil)
5/8  
  Color
White, Yellow, Black, etc.  
  Surface Plating
HAL, Plated Ni/Au, Immersion Ni/Au, etc.  
 
Plating Thickness (micro inch) Techniques Plating Type Min. Thickness Max. Thickness
  Plated Ni/Au Ni Thickness 100 150
    Au Thickness 1 3
  Immersion Ni/Au Ni Thickness 100 150
    Au Thickness 1 3
  Gold Finger Ni Thickness 120 150
    Au Thickness 5 30
Copper Plating Hole (micron) Copper Thickness 20 25
Base Copper Thickness Inner Layers and Outer Layers (oz) 0.5 6
Finished Copper Thickness Outer Layers 1 6.5
  Inner Layers 0.5 6
  Insulation Layer (mm) 0.06 ---
 
Line Width / Space (mil) Max. Copper Thickness  
4/4; 4/5 0.5 oz Line width shouldn't be less than the required value under ensure of space.
4/6; 5/5; 6/5 1 oz
5/6; 6/6 2 oz
6/8; 7/8; 8/8 3 oz
8/10; 9/10; 10/10 5 oz
 
Board Materials FR-4; Aluminium Base; High Frequency; PTFE; FPC; Thick Copper; Paper Base; BT Base; Pi Base; Rogers4003 (PPC: 4403); PTFE+Al 1
 
Board Outline Tolerance Finished Product Thickness Tolerance
L≤100mm: ±0.1mm  
100mm < L≤200mm: ±0.13mm H ≤1.0mm: ±0.1mm
200mm < L≤300mm: ±0.2mm 1.0mm < H≤1.6mm: ±0.14mm
300mm < L≤ ..... ±0.2mm 1.6mm < H≤2.0mm:±0.18mm
  2.0mm < H≤2.4mm:±0.22mm
  2.4mm < H≤3.0mm:±0.25mm
  3.0mm < H:±10
 
Impedance Control ±10%
 
Description Current Status
Max. Layers 36L
 
LW/LS Inner Layer 75/75um
  Outer Layer 75/75um
  Min. Mechanical Drilling 50um
  Aspect Ratio 15:1
  Copper Thickness 8 oz
  Impedance Control ±5%
Material High Frequency / Microwave Volume
  Halogen-Free Volume
  Lead-Free Volume
  Mix Material Volume
  Metal Based / Core Volume
  High Tg Volume
HDI 1+C+1 Volume
Rigid Reflex 14 Layers Volume
Buried Resistor / Capacitor Volume
Surface Technique OSP, Immersion Gold, Selective Gold Plating, Immersion Tin, HAL, Lead Free HAL, Immersion Silver
 
Copper Weight Conversions
Oz µm mil (0.001")
0.06 2 0.1
0.14 5 0.2
0.25 9 0.4
0.3 12 0.5
0.5 17.5 0.7
1 35 1.4
2 70 2.8
3 105 4.2
4 140 5.6