PCB MANUFACTURING
Our service does not stop at PCB reverse engineering & design; we also manage PCB manufacturing & distribution via our relationships with small & large contract manufacturers in China & overseas.
We specialise in Single & Double sided, Multilayer, Flexible, flexi-rigid & HDI requirements.
We only use certified producers of PCB's - Underwriters Laboratories
V0 rating for FR4
V0 rating for High Tg FR4
V0 rating for Flex
V0 rating for Flex-rigid using FR4
BS EN ISO 9001:2000
IECQ to BS 123000 (CECC) (Cert. no. 022/QCA)
Technical Capability
Maximum number of layers: 36
Minimum track: 75 & micro;m (3mil)
Minimum gap: 75 & micro;m (3mil)
Smallest mechanically drilled holes: 0.2mm
Smallest mechanically drilled blind holes: 150 & micro;m (6mil)
Smallest laser drilled holes: 25 & micro;m (1mil)
Smallest laser drilled blind holes: 50 & micro;m (2mil)
Smallest buried holes: 25a nd micro;m (1mil)
Aspect ratio max - through holes 15:1 (FHS)
Aspect ratio max - blind holes 1:1 (FHS)
Controlled Impedance & plusmn; 5%
Edge plating
Edge plated half holes
Edge plated fingers
Buried resistor +/- 15%
Resin filled vias
Copper filled blind vias
| Item | Technical Parameters | Specification | |
| Min. Line Width (mil) | 3 | Finished product Copper thickness 0.5 OZ | |
| Min. Space (mil) | 3 | Finished product Copper thickness 0.5 OZ | |
| Min. Annular Ring Width(mil) | VIAS: 3mils | Remained ring width means the distance between the hole edge to the ring outskirt | |
| Component Holes : 5mils | |||
| Min. Hole Size | Board Thickness < 2.0mm | 0.2mm | Finished product |
| Board Thickness < 1.2mm | 0.1mm | Finished product | |
| Board Thickness > 2.0mm | Aspect Ratio < 10 | Finished product | |
| Max. Board Thickness | Single and Double Side | 8.0mm | 1 |
| Multilayer | 8.0mm | ||
| Min. Board Thickness | Single and Double Side | 0.2mm | |
| Multilayer | 4 layers: 0.4mm; 6 layers: 0.6mm; 8 layers: 1.0mm; 10 layers: 1.2mm; | ||
| Max. Board Size | Single and Double Side | 609 x 609mm | |
| Multilayer | 550 x 810mm | ||
| Distance betweenLine to Board edge | Outline: 0.20mm | ||
| V-CUT: 0.4mm V-CUT: 0.33mm( Board Thickness< 1.2mm) | |||
| Max. Layers | 30 layers | ||
| Solder | Mask Window (mil) | 2/4 | 1. Single side; 2. 2mil is allowed for mask bridge or avoiding exposed lines. |
| Mask Bridge (mil) | 6 | Between IC pins | |
| Color | White, Black, Blue, Green, Yellow, Red, etc. | 1 | |
| Legend | Min. Line Width (mil) | 5/8 | |
| Color | White, Yellow, Black, etc. | ||||
| Surface Plating | HAL, Plated Ni/Au, Immersion Ni/Au, etc. | ||||
| Plating Thickness (microinch) | Techniques | Plating Type | Min. Thickness | Max. Thickness | |
| Plated Ni/Au | Ni Thickness | 100 | 150 | ||
| Au Thickness | 1 | 3 | |||
| Immersion Ni/Au | Ni Thickness | 100 | 150 | ||
| Au Thickness | 1 | 3 | |||
| Gold Finger | Ni Thickness | 120 | 150 | ||
| Au Thickness | 5 | 30 | |||
| Copper Plating Hole (micron) | Copper Thickness | 20 | 25 | ||
| Base Copper Thickness | Inner layers and Outer layers (oz) | 0.5 | 6 | ||
| Finished Copper Thickness | Outer Layers | 1 | 6.5 | ||
| Inner Layers | 0.5 | 6 | |||
| Insulation Layer (mm) | 0.06 | --- | |||
| Line Width/Space (mil) | Max. Copper Thickness | ||||
| 4/4; 4/5; | 0.5 oz | Line width shouldn't be less than the required value under ensure of space. | |||
| 4/6; 5/5; 6/5 | 1 oz | ||||
| 5/6; 6/6 | 2 oz | ||||
| 6/8; 7/8; 8/8 | 3 oz | ||||
| 8/10; 9/10; 10/10 | 5 oz | ||||
| Board Materials | FR-4; Aluminium Base; High Frequency; PTFE; FPC; Thick Copper; Paper Base; BT Base; Pi Base; Rogers4003 (PPC: 4403); PTFE+Al | 1 | |||
Board Outline Tolerance:
Impedance Control:
L≤100mm :±0.1mm;
100mm < L≤200mm :±0.13mm;
200mm < L≤300mm :±0.2mm;
300mm < L≤.....±0.2mm;
Impedance Control:
±10%
Finished Product Thickness Tolerance
H ≤1.0mm :±0.1mm;
1.0mm < H≤1.6mm:±0.14mm;
1.6mm < H≤2.0mm:±0.18mm;
2.0mm < H≤2.4mm:±0.22mm;
2.4mm < H≤3.0mm:±0.25mm;
3.0mm < H:±10%;
| Description | Current status | ||
| Max. Layers | 36L |
| LW/LS | Inner layer | 75/75um | ||
| Ourter layer | 75/75um | |||
| Min. Mechanical drilling | 50 um | |||
| Aspect ratio | 15:1 | |||
| Copper Thickness | 8 oz | |||
| Impedance Control | +-5% | |||
| Material | High frequency / Microwave | Volume | ||
| Halogen-free | Volume | |||
| Lead free | Volume | |||
| Mix-material | Volume | |||
| Metal based/core | Volume | |||
| High Tg | Volume | |||
| HDI | 1+C+1 | Volume | ||
| Rigid-flex | 14 layers | Volume | ||
| Buried Resistor/Capacitor | Volume | |||
| Surface Technique | OSP,Immersion gold,Selective gold plating,Immersion tin,HAL,Lead free HAL,Immersion silver | |||
| Copper Weight Conversions | ||
| Oz | µm | mil (0.001") |
| 0.06 | 2 | 0.1 |
| 0.14 | 5 | 0.2 |
| 0.25 | 9 | 0.4 |
| 0.3 | 12 | 0.5 |
| 0.5 | 17.5 | 0.7 |
| 1 | 35 | 1.4 |
| 2 | 70 | 2.8 |
| 3 | 105 | 4.2 |
| 4 | 140 | 5.6 |